Sacrificial Layer Technique for Releasing Metallized Multilayer SU-8 Devices

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Tatikonda , A , Jokinen , V P , Evard , H & Franssila , S 2018 , ' Sacrificial Layer Technique for Releasing Metallized Multilayer SU-8 Devices ' , Micromachines , vol. 9 , no. 12 , 673 .

Title: Sacrificial Layer Technique for Releasing Metallized Multilayer SU-8 Devices
Author: Tatikonda, Anand; Jokinen, Ville P.; Evard, Hanno; Franssila, Sami
Contributor organization: Division of Pharmaceutical Chemistry and Technology
Faculty of Pharmacy
Date: 2018-12
Language: eng
Number of pages: 11
Belongs to series: Micromachines
ISSN: 2072-666X
Abstract: The low fabrication cost of SU-8-based devices has opened the fields of point-of-care devices (POC), mu TAS and Lab-on-Chip technologies, which call for cheap and disposable devices. Often this translates to free-standing, suspended devices and a reusable carrier wafer. This necessitates a sacrificial layer to release the devices from the substrates. Both inorganic (metals and oxides) and organic materials (polymers) have been used as sacrificial materials, but they fall short for fabrication and releasing multilayer SU-8 devices. We propose photoresist AZ 15nXT (MicroChemicals GmbH, Ulm, Germany) to be used as a sacrificial layer. AZ 15nXT is stable during SU-8 processing, making it suitable for fabricating free-standing multilayer devices. We show two methods for cross-linking AZ 15nXT for stable sacrificial layers and three routes for sacrificial release of the multilayer SU-8 devices. We demonstrate the capability of our release processes by fabrication of a three-layer free-standing microfluidic electrospray ionization (ESI) chip and a free-standing multilayer device with electrodes in a microchannel.
Subject: SU-8
multi layered chips
AZ 15nXT
sacrificial release
free standing
116 Chemical sciences
317 Pharmacy
221 Nano-technology
Peer reviewed: Yes
Rights: cc_by
Usage restriction: openAccess
Self-archived version: publishedVersion

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