Manipulation of thin metal film morphology on weakly interacting substrates via selective deployment of alloying species

Näytä kaikki kuvailutiedot



Pysyväisosoite

http://hdl.handle.net/10138/346310

Lähdeviite

Jamnig , A , Pliatsikas , N , Abadias , G & Sarakinos , K 2022 , ' Manipulation of thin metal film morphology on weakly interacting substrates via selective deployment of alloying species ' , Journal of vacuum science & technology : an official journal of the American Vacuum Society , vol. 40 , no. 3 , 033407 . https://doi.org/10.1116/6.0001700

Julkaisun nimi: Manipulation of thin metal film morphology on weakly interacting substrates via selective deployment of alloying species
Tekijä: Jamnig, Andreas; Pliatsikas, Nikolaos; Abadias, Gregory; Sarakinos, Kostas
Tekijän organisaatio: Department of Physics
Päiväys: 2022-05
Kieli: eng
Sivumäärä: 9
Kuuluu julkaisusarjaan: Journal of vacuum science & technology : an official journal of the American Vacuum Society
ISSN: 0734-2101
DOI-tunniste: https://doi.org/10.1116/6.0001700
URI: http://hdl.handle.net/10138/346310
Tiivistelmä: We demonstrate a versatile concept for manipulating morphology of thin (& LE;25 nm) noble-metal films on weakly interacting substrates using growth of Ag on SiO2 as a model system. The concept entails deployment of minority metallic (Cu, Au, Al, Ti, Cr, and Mo) alloying species at the Ag-layer growth front. Data from in situ and real-time monitoring of the deposition process show that all alloying agents-when deployed together with Ag vapor throughout the entire film deposition-favor two-dimensional (2D) growth morphology as compared to pure Ag film growth. This is manifested by an increase in the substrate area coverage for a given amount of deposited material in discontinuous layers and a decrease of the thickness at which a continuous layer is formed, though at the expense of a larger electrical resistivity. Based on ex situ microstructural analyses, we conclude that 2D morphological evolution under the presence of alloying species is predominantly caused by a decrease of the rate of island coalescence completion during the initial film-formation stages. Guided by this realization, alloying species are released with high temporal precision to selectively target growth stages before and after coalescence completion. Pre-coalescence deployment of all alloying agents yields a more pronounced 2D growth morphology, which for the case of Cu, Al, and Au is achieved without compromising the Ag-layer electrical conductivity. A more complex behavior is observed when alloying atoms are deposited during the post-coalescence growth stages: Cu, Au, Al, and Cr favor 2D morphology, while Ti and Mo yield a more pronounced three-dimensional morphological evolution. The overall results presented herein show that targeted deployment of alloying agents constitutes a generic platform for designing bespoken heterostructures between metal layers and technologically relevant weakly interacting substrates.& nbsp;Published under an exclusive license by the AVS.
Avainsanat: 114 Physical sciences
Vertaisarvioitu: Kyllä
Tekijänoikeustiedot: unspecified
Pääsyrajoitteet: openAccess
Rinnakkaistallennettu versio: acceptedVersion


Tiedostot

Latausmäärä yhteensä: Ladataan...

Tiedosto(t) Koko Formaatti Näytä
Manuscript_Jamnig_et_al_revised_2_unmarked.pdf 1010.KB PDF Avaa tiedosto

Viite kuuluu kokoelmiin:

Näytä kaikki kuvailutiedot