TY  -  
T1  - Atomic Layer Deposition of Intermetallic Co3Sn2 and Ni3Sn2 Thin Films 
SN  -  /  
UR  - http://hdl.handle.net/10138/322271 
T3  -  
A1  - Väyrynen, Katja; Hatanpää, Timo; Mattinen, Miika; Mizohata, Kenichiro; Meinander, Kristoffer; Räisänen, Jyrki; Link, Joosep; Stern, Raivo; Ritala, Mikko; Leskela, Markku 
A2  -  
PB  -  
Y1  - 2019 
LA  - eng 
AB  - Intermetallics form a versatile group of materials that possess unique properties ranging from superconductivity to giant magnetoresistance. The intermetallic Co-Sn and Ni-Sn compounds are promising materials for magnetic applications as well as for anodes in lithium- and sodium-ion batteries. Herein, a method is presented for the preparation of Co3Sn2 and Ni3Sn2 thin films using diamine adducts of cobalt(II) and nickel(II) chlorides, CoCl2(TMEDA) and NiCl2(TMPDA) (TMEDA = N,N,N ',N '-tetramethy... 
VO  -  
IS  -  
SP  -  
OP  -  
KW  - atomic layer deposition; Co3Sn2; intermetallics; Ni3Sn2; thin films; ELECTROCHEMICAL PERFORMANCE; CATALYTIC-PROPERTIES; DIFFUSION BARRIER; TIN-OXIDE; LITHIUM; ALLOY; SUPERCONDUCTIVITY; NANOPARTICLES; NANOALLOYS; ELECTRODES; 221 Nano-technology; 116 Chemical sciences; 114 Physical sciences 
N1  -   
PP  -  
ER  -