TY  -  
T1  - Sacrificial Layer Technique for Releasing Metallized Multilayer SU-8 Devices 
SN  -  /  
UR  - http://hdl.handle.net/10138/298299 
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A1  - Tatikonda, Anand; Jokinen, Ville P.; Evard, Hanno; Franssila, Sami 
A2  -  
PB  -  
Y1  - 2018 
LA  - eng 
AB  - The low fabrication cost of SU-8-based devices has opened the fields of point-of-care devices (POC), mu TAS and Lab-on-Chip technologies, which call for cheap and disposable devices. Often this translates to free-standing, suspended devices and a reusable carrier wafer. This necessitates a sacrificial layer to release the devices from the substrates. Both inorganic (metals and oxides) and organic materials (polymers) have been used as sacrificial materials, but they fall short for fabrication an... 
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KW  - SU-8; multi layered chips; AZ 15nXT; sacrificial release; microchips; microfabrication; microfluidics; free standing; FABRICATION; PHOTORESIST; RESIST; DNA; 116 Chemical sciences; 317 Pharmacy; 221 Nano-technology 
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